Thursday 7 July 2022 - IDTechEx will discuss how vertical farms can fit in with the coming age of agriculture. This webinar will include discussions on what vertical farms can bring to the agricultural industry, an overview of several limitations faced by the vertical farming industry today, and several possible methods for vertical farms to increase profitability

After months of testing at the "Arena del Futuro" circuit, Stellantis, together with its project partners, have demonstrated the capability of Dynamic Wireless Power transfer (DWPT) technology to wirelessly recharge electric vehicles as they travel over specially equipped, dedicated road lanes.

This premium article explores the opportunities for transparent antennas, delving into the addressable industry verticals, the value chain, and technical challenges associated with such opportunities.

This premium article is IDTechEx's second article delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.

This premium article is one of two delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.

Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000.

Researchers have developed a novel and flexible additively manufactured tile-based approach to construct on-demand, massively scalable arrays of 5G+ (5G/Beyond 5G)‐enabled smart skins with the potential to enable intelligence on nearly any surface or object.

The current state of 5G has seen less technological innovation than might have initially been expected. There is certainly more scope for technical development and hence opportunities for several technologies and materials, a critical one of which is the semiconductor technology with wide bandgap semiconductors.

This premium article delves into the Mobile World Congress (MWC) 2022 event held in Barcelona. It will look into mmWave development in both applications and infrastructure, with particular examples from telecom carriers, system vendors, chip and platform providers, and more. It will also investigate recent Huawei 5G network infrastructure news and future projections.

This premium article delves into the Mobile World Congress (MWC) 2022 event held in Barcelona. It will look into the key applications for the connected world, such as smart homes, future connected mobility and Metaverse (AR/VR), with a Q&A with the director of the 5GAA.

The MWC event in Barcelona earlier this month gathered more than 60,000 mobile experts from all around the world. From digital applications to network infrastructure, IDTechEx was there to cover major developments in the industry! Here are some of the key trends we observed at MWC2022 Barcelona.

Thursday 3 March 2022 - Introduction to changes in telecommunications infrastructure; Choice of semiconductor technology for sub-6 GHz and mmWave 5G; Case studies of sub-6 GHz and mmWave antenna; Overview of die attach materials and methodology; and Thermal interface materials for infrastructure and smartphone

This article gives a preview - before appearance in our reports - of our latest perception of the planned 6G Communications from a materials, components and devices viewpoint.

Leading edge electronics and electrical engineering includes: Terahertz electronics - microwave to far infrared optics Photovoltaics Electric vehicle and microgrid power electronics.

Overview by IDTechEx analyst Yu-Han Chang

This article gives a quick update on the present state of 5G in two major countries: China and the United States. More information will be provided following IDTechEx's participation in MWC2022 at the end of February.

There are three main potential substrates for RF GaN devices, Si, SiC or diamond. As a substrate alone, Si is the cheapest, but SiC and diamond have several other advantages.

There are two key frequencies to be used in 5G: sub-6 GHz and mmWave.

If only one phrase could be used to define our future, it would be "data-centric," which is enabled by data abundant applications such as big data, machine learning, and AI.