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Transparent Antennas: Emerging Application for Transparent Conductors

Transparent Antennas: Emerging Application for Transparent Conductors

IDTechEx Research Subscribers
European Microwave Week Event 2022 — Part 2

European Microwave Week Event 2022 — Part 2

This premium article is IDTechEx's second article delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.
IDTechEx Research Subscribers
European Microwave Week Event 2022 — Part 1

European Microwave Week Event 2022 — Part 1

This premium article is one of two delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.
Telecoms Tech Research
Apr 6, 2022
High Thermal Conductivity TIM from Henkel

High Thermal Conductivity TIM from Henkel

Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000.
IDTechEx Research Subscribers
MWC 2022 Event Highlights — mmWave Development

MWC 2022 Event Highlights — mmWave Development

This premium article delves into the Mobile World Congress (MWC) 2022 event held in Barcelona. It will look into mmWave development in both applications and infrastructure, with particular examples from telecom carriers, system vendors, chip and platform providers, and more. It will also investigate recent Huawei 5G network infrastructure news and future projections.
IDTechEx Research Subscribers
MWC 2022 Event Highlights — Applications for the Connected Future

MWC 2022 Event Highlights — Applications for the Connected Future

This premium article delves into the Mobile World Congress (MWC) 2022 event held in Barcelona. It will look into the key applications for the connected world, such as smart homes, future connected mobility and Metaverse (AR/VR), with a Q&A with the director of the 5GAA.
IDTechEx Research Subscribers
6G Communications 2022 Situation

6G Communications 2022 Situation

This article gives a preview - before appearance in our reports - of our latest perception of the planned 6G Communications from a materials, components and devices viewpoint.
IDTechEx Research Subscribers
Vanadium Oxide Next Key Material

Vanadium Oxide Next Key Material

Leading edge electronics and electrical engineering includes: Terahertz electronics - microwave to far infrared optics Photovoltaics Electric vehicle and microgrid power electronics.
IDTechEx Research Subscribers
Where is 3D IC packaging technology going?

Where is 3D IC packaging technology going?

Overview by IDTechEx analyst Yu-Han Chang
IDTechEx Research Subscribers
Si transistor development for HPC applications

Si transistor development for HPC applications

If only one phrase could be used to define our future, it would be "data-centric," which is enabled by data abundant applications such as big data, machine learning, and AI.
IDTechEx Research Subscribers
European Microwave Week Event 2022 — Part 2

European Microwave Week Event 2022 — Part 2

This premium article is IDTechEx's second article delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.
Telecoms Tech Research
Apr 6, 2022
High Thermal Conductivity TIM from Henkel

High Thermal Conductivity TIM from Henkel

Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000.
IDTechEx Research Subscribers
MWC 2022 Event Highlights — Applications for the Connected Future

MWC 2022 Event Highlights — Applications for the Connected Future

This premium article delves into the Mobile World Congress (MWC) 2022 event held in Barcelona. It will look into the key applications for the connected world, such as smart homes, future connected mobility and Metaverse (AR/VR), with a Q&A with the director of the 5GAA.
IDTechEx Research Subscribers
Vanadium Oxide Next Key Material

Vanadium Oxide Next Key Material

Leading edge electronics and electrical engineering includes: Terahertz electronics - microwave to far infrared optics Photovoltaics Electric vehicle and microgrid power electronics.
IDTechEx Research Subscribers
Si transistor development for HPC applications

Si transistor development for HPC applications

If only one phrase could be used to define our future, it would be "data-centric," which is enabled by data abundant applications such as big data, machine learning, and AI.
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