This premium article explores the European Chips Act, exploring the plans, goals, investments, budgets, situations in various EU countries, and the current status of the act.

LG Electronics has successfully tested the wireless transmission and reception of 6G terahertz data - at a frequency range of 155 to 175 GHz - over a distance of 320 meters outdoors. The milestone represents a significant step toward commercializing 6G THz in both indoor and outdoor urban areas since the reference cell coverage of base stations for urban macro cells is a distance of approximately 250 meters outdoors. It is also a major jump from August last year, when LG proved it could transfer 6G THz data over a distance of 100 meters outdoors.

This premium article looks into metamaterials and reconfigurable intelligent surfaces (RIS) for 5G, exploring functionalities, architecture, applications, and more.

Thermal management is an often overlooked yet imperative part of our modern lives. The recent Thermal Management Expo and Conference was timely for both end users and material providers, with speakers ranging from Meta to W.L. Gore. In this article, IDTechEx highlights some of the key discussion points and takeaways from this 2-day event.

Thursday 25 August 2022 - Analysis of advanced semiconductor packaging markets and their mid-long-term opportunity; Key applications' growth drivers; Player analysis - the dynamics of advanced semiconductor packaging battleground; Advanced semiconductor packaging technologies - current challenges and innovative trends

This premium article introduces metamaterials, with examples and important applications, and explores the commercial metamaterial ecosystem, technical and commercial challenges, and more.

If the future were to be categorized in one word, it would be "data-centric". IC vendors have been pushed towards "advanced semiconductor packaging" to meet the world's data needs.

Vertical farming, the practice of growing crops indoors on vertically stacked layers, has received no small amount of interest over the last few years. The recent IDTechEx report, "Vertical Farming 2022-2032", details the economic and technological factors shaping this rapidly growing industry.

IDTechEx attended the SEMICON West conference from 11-14th July 2022, held in San Francisco. This premium article will focus on the core themes and industry insight from the sustainability summit.

This premium article is aimed to give readers a comprehensive overview of advanced semiconductor packaging technologies utilized in server graphical processing units (GPU) in data centers.

This premium article explores recent updates with regards to 5G open RAN ecosystems, looking at global deployment and key market players, as well as a market outlook.

This premium article explores mobile private networks, looking at the landscape and business value chain as well as examples from key market players.

Whilst much of the "5G" infrastructure is a moderate upgrade on existing 4G technology, there is still plenty of scope for higher frequency deployment such as mmWave devices and very different station types such as small cells. Each of these new developments presents its own technological evolution and with it, thermal challenges.

Thursday 7 July 2022 - IDTechEx will discuss how vertical farms can fit in with the coming age of agriculture. This webinar will include discussions on what vertical farms can bring to the agricultural industry, an overview of several limitations faced by the vertical farming industry today, and several possible methods for vertical farms to increase profitability

After months of testing at the "Arena del Futuro" circuit, Stellantis, together with its project partners, have demonstrated the capability of Dynamic Wireless Power transfer (DWPT) technology to wirelessly recharge electric vehicles as they travel over specially equipped, dedicated road lanes.

This premium article explores the opportunities for transparent antennas, delving into the addressable industry verticals, the value chain, and technical challenges associated with such opportunities.

This premium article is IDTechEx's second article delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.

This premium article is one of two delving into the European Microwave Week Event. The focus of these articles will be on mmWave technology trends and packaging technologies, as well as advancements in high power MMICs (GaN/GaAs) and front-end modules for 5G/6G telecom applications.

Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000.