With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

Wednesday 28 June - Where Metamaterials Meet Tele-Communications. What is a reconfigurable intelligent surface (RIS), and why are they likely to be needed for high frequency telecommunications.; The different types of RIS (passive, semi-passive, active) and where they are likely to be deployed; Manufacturing processes and materials required for RIS production.

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

Thermal Interface Materials (TIMs) come in different forms, including thermal pads, thermal grease, gap fillers, thermal paste, and thermal gels. Thermal gel and thermal paste, two of the most commonly used forms, have gained significant momentum over the past several years, especially in the EV, data center, and 5G industries.

Legislation restricting the usage of "forever chemicals", or per- and polyfluoroalkyl substances (PFAS), is being debated in major markets like the European Union and the US.

6G is the next generation of wireless technology that promises to go beyond mobile communication and revolutionize how people interact with the world around them. According to IDTechEx's latest 6G research, 6G could be with us in 2028 at the earliest.

Thursday 20 April - The Surging Market for Thermal Interface Materials. This webinar will give a general overview of the TIMs used in EV, Data Center, ASAS, EMI shielding, 5G, and Consumer Electronics. The webinar discusses how TIM properties and demand will change with an analysis of the market trend and industrial news and collaborations.

Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase change materials.

Three years after 5G was officially commercialized, while most of the deployments are primarily focused on 5G mid-band, the development of 5G mmWave technology has also been underway. 5G mmWave, operating in high-frequency bands between 24-100 GHz, offers faster data transfer rates, low latency, and higher bandwidth compared to the previous wireless technology.

When thinking of the applications of low-loss materials in 5G devices, the first that comes to mind for most is 5G smartphones. After all, low-loss materials are integral in enabling advanced 5G antennas-in-packages (AiP) for smartphones, and high-profile smartphone manufacturers like Apple have gone back and forth about which low-loss material they chose for their 5G antennas in their flagship phones like the iPhone.

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer.

Refractive lenses are an 800-year-old technology that has stood the test of time. Glasses, cameras, and microscopy are all applications that rely on lenses to redirect light by varying the optical path through a curved piece of glass or plastic. However, the underlying architecture of lenses may be about to change.

6G, compared to its predecessor, is expected to offer significantly better communication capabilities, such as Tbps-level peak data rates, microsecond-level latency, and 99.99999% network dependability.

The next generation of telecoms technologies, 5G, is not fully deployed yet; in fact, the exciting high-frequency bands of mmWave 5G are not set to take off for another several years, according to IDTechEx forecasts.

Though 5G mmWave is still in its early stages, the 6G research race has already begun. The sub-THz band (100 - 300 GHz) is the major focus of the first wave of 6G. Several technological breakthroughs are necessary to fully realize the benefits of such a high frequency band in 6G.

Breaking Down the Drivers and Barriers Impacting Low-Loss Materials for 5G. Each year, the global deployment of 5G-enabled devices and infrastructure expands, bringing new and exciting applications to market, like smart devices, autonomous vehicles, and remote medical monitoring. However, the expansion of the 5G network, particularly the higher frequency mmWave bands, is restricted by several challenges.

While 5G mmWave has yet to take off, 6G research has already begun. But what exactly is 6G, and what are the emerging areas to watch?