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Where is 3D IC packaging technology going?
Overview by IDTechEx analyst Yu-Han Chang
IDTechEx Research Subscribers
5G in China and the US
This article gives a quick update on the present state of 5G in two major countries: China and the United States. More information will be provided following IDTechEx's participation in MWC2022 at the end of February.
IDTechEx Research Subscribers
The GaN Market for RF in 5G
There are three main potential substrates for RF GaN devices, Si, SiC or diamond. As a substrate alone, Si is the cheapest, but SiC and diamond have several other advantages.
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The Choice of Semiconductor Technology for 5G
There are two key frequencies to be used in 5G: sub-6 GHz and mmWave.
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Si transistor development for HPC applications
If only one phrase could be used to define our future, it would be "data-centric," which is enabled by data abundant applications such as big data, machine learning, and AI.
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EV Materials at the Adhesives and Bonding Expo (Foam Expo)
In this article, we summarise some of our EV material related highlights from the Adhesives and Bonding Expo Europe 2021 within the Foam Expo.
External Company Press Release
3D Printed Electronics Solution Increases 5G Signals by up to 100%
Optomec has introduced a new high performance semiconductor packaging solution for the rapidly growing mm-wave electronics market, in response to demands from its customers in the 5G, Autonomous Vehicle, Defense and Medical segments.
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Antenna technology for high frequency devices
IDTechEx overview of antenna technology for high frequency devices