5G

With the continuous increase in the thermal design power (TDP) of chips, traditional air-cooling methods are struggling to meet the cooling requirements of modern hyperscale data centers. As a result, liquid cooling has emerged as a promising solution due to the high specific heat capacity of liquids.

Thursday 20 July 2023 - Navigating the Liquid Cooling Dominance in Data Centers - An IDTechEx Roadmap; Air cooling: An overview of the traditional air-cooling approach and its benefits and limitations; Direct-to-chip/Cold Plate Cooling: An exploration of cooling methods that involve direct contact between the cooling medium and the chips or the use of cold plates; Immersion cooling: An examination of cooling techniques that utilize immersion of servers or components in dielectric fluids; Coolant comparison and regulations: A comparison of different coolants used in liquid cooling systems, along with relevant regulations; Single-phase and two-phase cooling: An analysis of single-phase and two-phase cooling methods and their applications in data centers; Thermal interface materials (TIMs): An overview of the importance of thermal interface materials in efficient heat transfer within cooling systems.

Over the past 16 years, the thermal design power (TDP) of GPUs has quadrupled. With the increasing demand for AI, cloud computing, and crypto mining, IDTechEx expects the power consumption of server boards and data centers to continue rising.

Wednesday 28 June - Where Metamaterials Meet Tele-Communications. What is a reconfigurable intelligent surface (RIS), and why are they likely to be needed for high frequency telecommunications.; The different types of RIS (passive, semi-passive, active) and where they are likely to be deployed; Manufacturing processes and materials required for RIS production.

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

Thermal Interface Materials (TIMs) come in different forms, including thermal pads, thermal grease, gap fillers, thermal paste, and thermal gels. Thermal gel and thermal paste, two of the most commonly used forms, have gained significant momentum over the past several years, especially in the EV, data center, and 5G industries.

Legislation restricting the usage of "forever chemicals", or per- and polyfluoroalkyl substances (PFAS), is being debated in major markets like the European Union and the US.

6G is the next generation of wireless technology that promises to go beyond mobile communication and revolutionize how people interact with the world around them. According to IDTechEx's latest 6G research, 6G could be with us in 2028 at the earliest.

Thursday 20 April - The Surging Market for Thermal Interface Materials. This webinar will give a general overview of the TIMs used in EV, Data Center, ASAS, EMI shielding, 5G, and Consumer Electronics. The webinar discusses how TIM properties and demand will change with an analysis of the market trend and industrial news and collaborations.